"Hardhat" Sockets
Tecknit's "Hardhat" sockets are designed to provide maximum electrical test performance,
with high repeatability in both production and laboratory environments.
Available in BGA, and LGA socket versions, Tecknit "Hardhat" sockets offer
solderless interconnection between IC packages and printed circuit boards. Interconnection
is accomplished using Tecknit "Fuzz ButtonŽ" technology. Fuzz Buttons,
acting like miniature springs, are combined with Tecknit'c "Hardhat" contact
elements to provide the shortest electrical path available. Multiple
"Hardhat" tip configurations are available to mate perfectly with BGA
solderballs or low profile LGA pads. Tecknit Fuzz buttons are fully retained, protected
beneath the "Hardhat" contacts, and are removable only from the PC board side
of the socket. Providing virtually "invisible" interconnection. Tecknit's
"Hardhat" sockets are used in high speed test applications to ensure reduced
signal distortion.
| Performance Data |
.030" Dia. Au/Be/Cu @1.27 mm Spacing |
.020" Dia. Au/Be/Cu @1.00 mm Spacing |
|||||
|---|---|---|---|---|---|---|---|
| 10 Mhz | 100 Mhz | 1 Ghz | 10 Mhz | 100 Mhz | 1 Ghz | ||
| Max. Attenuation | dB | 0.00 | 0.01 | 0.20 | 0.02 | 0.05 | 0.45 |
| Impedance | ohm | 50.0 | 49.8 | 49.5 | 50.5 | 52.0 | 52.8 |
| Standing Voltage Wave Ratio | -- | 1.00 | 1.04 | 1.05 | 1.00 | 1.01 | 1.05 |
| Near End Cross Talk (Grd-Sig-Sig-Grd) |
dB | -62 | -42 | -21 | -62 | -42 | -27 |
| Near End Cross Talk (Sig-Grd-Sig) |
dB | -82 | -60 | -41 | -62 | -45 | -20 |
| .030" Dia. Au/Be/Cu @1.27 mm Spacing |
.020" Dia. Au/Be/Cu @1.00 mm Spacing |
||
|---|---|---|---|
| Current Rating (Continuous) | Amp | 5 | 4 |
| Propagation Delay | pS | <50 | <50 |
| Rise Time | pS | 100 | 100 |
| Self Inductance | nH | 2.3 Max | 2.7 Max |
| Mutual Inductance | nH | 1.9 Max | 2.3 Max |
| Capacitance | pF | .2 Max. | .3 Max. |
| Low Level Circuit Resistance | m-ohm | <20 | <20 |
| Operating Temperature Range* | °C | -55 to +85 | -55 to +85 |
| * Alternate wire materials are availble for high temperature appplications | |||