Application Bulletin

Stamping Capabilities

Application Problem: To shield small board level components to reduce emissions and the protect against interference. The shield must be rigid to protect the components and able to be soldered to the board. Once a customer has isolated the specific item, it can be shielded by covering it with metal "can" and grounding it to the board.

Innovative Solution: Tecknit designed a perforated beryllium copper box that will be soldered directly to the board. This design will provide 60 db of shielding and also allow the heat to dissipate through the hole pattern on the top. The shields are also plated with tin/lead to improve the solderability of the parts.

Benefits:

: Inexpensive in large volumes.
: Easy installation.
: Can be supplied on tape and reel.
: Can be designed for heat dissipation.
: Various platings improve solderability and prevent corrosion.

	Tecknit 135 Bryant Street Cranford, NJ 07016 Tel: 908-272-5500 Fax: 908-272-2741 England: 011-441476590600 Bejiing: 8610-6515-6272 E-Mail: tecknit@tecknit.com URL: http://tecknit.com