Application Problem: As electronic housings such as cellular phones sets and pager systems get smaller and the electrical and shielding design requirements put upon them increases, also does the need for low cost, easy to apply EMI shielding and grounding materials. These assemblies need electrical connections to complete grounding paths and form EMI shields. Compressible conductive contacts are often needed for grounding the PC boards to the housing making making contact between the mating halves of the housing. In addition, commercial consumer products usually require that all shielding and grounding materials be compliant with the UL94 flammability ratings.
Innovative Solution: The Tecknit solution is use a Tecksof 2000 contact pad. These metalized, fabric wrapped, foam parts act as grounding connections between the solder tracing on a board and the metalized housing surface. The Tecksof 2000 contact pad has a pressure sensitive adhesive backing to allow for easy pick and place installation. Parts can be supplied kiss-cut to the PSA liner in continuous strips or as required for the application. These contact pads are inexpensive compared to equivalent metal stampings which often require costly assembly equipment. Typical contact pads are .250" - 1.0" in length and can be made in variety of profiles (see Tecksof 2000 data sheet).
Benefits:
Low cost
electrically conductive connector.
Soft compressible
foam core offers minimal compression force which is ideal for fragile
plastic housings.
Can be made
from a variety of profile shapes.
PSA attachment
system allows for easy "pick and place" assembly.
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Tecknit 135 Bryant Street Cranford, NJ 07016 Tel: 908-272-5500 Fax: 908-272-2741 England: 011-441476590600 Bejiing: 8610-6515-6272 E-Mail: tecknit@tecknit.com URL: http://tecknit.com |
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