Application Problem: Small board level components require shielding to reduce emissions and to protect against interference. The shield must be capable of being soldered to the board and rigid enough to protect the components. Once a specific item is isolated, it is covered with a metal "can" grounded to the board, shielding the component.
Innovative Solution: A stamped beryllium copper box, possibly supplied with ventilation holes, is grounded to the board to shield the component. The design will provide 60 db of shielding and also allow heat to dissipate through a hole pattern in the top of the can. The plating will improve the solderability of the can to the board.
Benefits:
Easy Installation.
Cost effective
in large volumes.
Can be designed
for heat dissipation.
Various optional
platings improve solderability and prevent corrosion.
Can be
supplied on tape and reel.
 |
Tecknit 135 Bryant Street Cranford, NJ 07016 Tel: 908-272-5500 Fax: 908-272-2741 England: 011-441476590600 Bejiing: 8610-6515-6272 E-Mail: tecknit@tecknit.com URL: http://tecknit.com |
 |
|---|